FOB Price
Get Latest Price1 ~ 2 / Sheet
|5 Sheet Minimum Order
Country:
China
Model No:
GPHC3.0
FOB Price:
1 ~ 2 / Sheet Get Latest Price
Place of Origin:
USA
Price for Minimum Order:
1 per Sheet
Minimum Order Quantity:
5 Sheet
Packaging Detail:
box
Delivery Time:
-
Supplying Ability:
100 Sheet per Week
Payment Type:
T/T
Product Group :
Contact Person Carrie
Shenzhen, Guangdong
BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC***0
BERGQUIST GAP PAD TGP HC***0 is a soft and compliant gap filling material with a thermal conductivity
of 3.0 W/m-K.The material offers exceptional thermal performance at low pressures due to a unique 3.0 W/m-K
filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiring
low stress on components and boards during assembly. BERGQUIST GPHC3.0 maintains a conformable
nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness
and/or topography.
BERGQUIST GAP PAD HC 3.0 Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
Configurations Available:
• Sheet form and die-cut parts
For more product information, please feel free to contact us
| Country: | China |
| Model No: | GPHC3.0 |
| FOB Price: | 1 ~ 2 / Sheet Get Latest Price |
| Place of Origin: | USA |
| Price for Minimum Order: | 1 per Sheet |
| Minimum Order Quantity: | 5 Sheet |
| Packaging Detail: | box |
| Delivery Time: | - |
| Supplying Ability: | 100 Sheet per Week |
| Payment Type: | T/T |
| Product Group : | GAP PAD SERIES |
